1/4 rev. a structure silicon monolithic integrated circuit type 1ch regulator ic product series BD35632EFJ features ? ceramic capacitor 1uf ? built-in soft start function absolute maximum ratings (ta=25 ) parameter symbol rating unit power supply voltage vcc 15.0 * 1 v enable input voltage ven 15.0 v output voltage vo 15.0 v output reference voltage v fb 15.0 v power dissipation pd 2110* 2 mw operating temperature range topr -40 +100 storage temperature range tstg -55 +150 maximum junction temperature tjmax +150 *1 should not exceed pd. *2 reduced by 16.9mw/ for each increase in ta R25 (when mounted on a 70mm 70mm 1.6mm glass-epoxy board, two layer) operating conditions (ta=25 ) parameter symbol min. max. unit input power supply voltage vcc 6.0 14.0 v enable input voltage ven 0.0 14.0 v output voltage setting range vo 1.5 13.0 v output current io 0.0 1.0 a this product is not designed for use in radioactive environments.
2/4 rev. a electrical characteristics (unless otherwise specified, ta=25 , ven=3v, vcc=12v, r 1 =91k , r 7 =3.3k ,r 2 =8.2k * 1 ) parameter symbol limit unit conditions min typ max circuit current at shutdown isd - 0 5 a ven=0v, off mode bias current icc - 700 900 a line regulation reg.ii - 25 50 mv vcc=(vo+0.92v) 14.0v load regulation reg.io 25 75 mv io=0 1.0a i/o voltage difference vco - 0.60 0.92 v vcc=12v, io=1.0a output reference voltage v fb 0.792 0.800 0.808 v io=0ma en low voltage ven(low) 0 - 0.8 v en high voltage ven(high) 2.4 - 14.0 v en bias current ien 1 3 9 a *1 vo=v fb (r 1 +r 2 ) r 2 [v]
3/4 rev. a physical dimensions block diagram pin number ? pin name pin no. pin name pin function 1 vcc input voltage pin 2 n.c open 3 vo output voltage pin 4 fb output reference voltage pin(feed back pin) 5 gnd gnd pin 6 gnd gnd pin 7 en enable pin 8 n.c open reverse fin substrate * please short n.c, fin to the gnd. d35632 lot no (unit : mm ) 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark htsop-j8 ceramic capacitor vo vcc gnd en fb ocp soft tsd 1 3 5 7 4 r 1 r 2 (vo+0.92) 14v 1.5 13v R 1uf R 1uf ceramic capacitor 6 r 7
4/4 rev. a note for use 1. absolute maximum ratings an excess in the absolute maximum ratings, such as supp ly voltage, temperature range of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute ma ximum ratings, consider adding circuit protection devices, such as fuses. 2. connecting the power supply connector backward connecting of the power supply in reverse polarity can da mage ic. take precautions when connecting the power supply lines. an external direction diode can be added. 3. power supply lines please add a protection diode when a large inductance co mponent is connected to the output terminal, and reverse-polarity power is possible at startup or in output off condition. 4. gnd voltage the potential of gnd pin must be minimu m potential in all operating conditions. 5. thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. 6. inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. t he ic may be damaged if there is any connection error or if pins are shorted together. 7. actions in strong electromagnetic field use caution when using the ic in the presence of a strong electromagnetic fi eld as doing so may cause the ic to malfunction. 8. aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. 9. thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect th e ic or guarantee its operation. do not continue to use the ic after operating this circuit or use the ic in an envir onment where the operation of this circuit is assumed. tsd on temperature [c] (typ.) hysteresis temperature [c] (typ.) BD35632EFJ 175 15 10. testing on application boards when testing the ic on an application board, connecti ng a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each process or step. always tu rn the ic's power supply off before connecting it to or removing it from a jig or fixture during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precaution when transporting or storing the ic.
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